Semiconductor Packaging Materials Interaction and Reliability

• Yazar: Chen, Andrea (auth)
• Diğer Yazarlar: Lo, Randy Hsiao-Yu (auth)
• Materyal Türü: Elektronik Kitap Bölümü
• Dil: İngilizce
• Baskı/Yayın Bilgisi: Taylor & Francis 2012
• Konular: Electronics engineering; Circuits & components; Materials science; Circuits and Devices; Electromagnetics and Microwaves; Electronic Packaging; ENG; MATERIALS; ElectricalEngineering; SCI-TECH; STM; array; ball; compound; frame; grid; lead; level; molding; package; wafer
• Online Erişim: OAPEN Library: download the publication; OAPEN Library: description of the publication

Özet

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Fiziksel Özellikler

1 electronic resource (216 p.)

ISBN

b11260

Erişim

Open Access