Hybrid photonic assemblies based on 3D-printed coupling structures
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...
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| Main Author: | |
|---|---|
| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
KIT Scientific Publishing
2023
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| Series: | Karlsruhe Series in Photonics & Communications
28 |
| Subjects: | |
| Online Access: | OAPEN Library: download the publication OAPEN Library: description of the publication |
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| 245 | 1 | 0 | |a Hybrid photonic assemblies based on 3D-printed coupling structures |
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| 490 | 1 | |a Karlsruhe Series in Photonics & Communications |v 28 | |
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| 520 | |a Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML). | ||
| 540 | |a Creative Commons |f https://creativecommons.org/licenses/by-sa/4.0/ |2 cc |4 https://creativecommons.org/licenses/by-sa/4.0/ | ||
| 546 | |a English | ||
| 650 | 7 | |a Electrical engineering |2 bicssc | |
| 653 | |a Photonische Aufbau- und Verbindungstechnik; integrierte photonische Schaltkreise; Multiphotonenlithographie; additive 3D Mikrofabrikation; Mikrooptik; photonic packaging; photonic integrated circuits (PIC); multi-photon lithographie; additive 3D micro-fabrication; micro-optics | ||
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| 856 | 4 | 0 | |a www.oapen.org |u https://library.oapen.org/handle/20.500.12657/62898 |7 0 |z OAPEN Library: description of the publication |