Hybrid photonic assemblies based on 3D-printed coupling structures
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed...
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Format: | Electronic Book Chapter |
Language: | English |
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KIT Scientific Publishing
2023
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Series: | Karlsruhe Series in Photonics & Communications
28 |
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Online Access: | OAPEN Library: download the publication OAPEN Library: description of the publication |
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DOAB: description of the publication
Hybrid photonic assemblies based on 3D-printed coupling structures
Published 2023
DOAB: download the publication
DOAB: description of the publication
Electronic
Book Chapter