Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...
Salvato in:
Autore principale: | |
---|---|
Natura: | Elettronico Capitolo di libro |
Pubblicazione: |
KIT Scientific Publishing
2023
|
Soggetti: | |
Accesso online: | OAPEN Library: download the publication OAPEN Library: description of the publication |
Tags: |
Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne!!
|
Accesso online
OAPEN Library: download the publicationOAPEN Library: description of the publication
3rd Floor Main Library
Collocazione: |
A1234.567 |
---|---|
Copia 1 | Disponibile |