Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit

The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...

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Autore principale: Kohler, Tobias (auth)
Natura: Elettronico Capitolo di libro
Pubblicazione: KIT Scientific Publishing 2023
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