Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...
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| Formato: | Electrónico Capítulo de libro |
| Publicado: |
KIT Scientific Publishing
2023
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| Materias: | |
| Acceso en línea: | OAPEN Library: download the publication OAPEN Library: description of the publication |
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OAPEN Library: download the publicationOAPEN Library: description of the publication
3rd Floor Main Library
| Número de Clasificación: |
A1234.567 |
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| Copia 1 | Disponible |