Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit

The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...

पूर्ण विवरण

में बचाया:
ग्रंथसूची विवरण
मुख्य लेखक: Kohler, Tobias (auth)
स्वरूप: इलेक्ट्रोनिक पुस्तक अध्याय
प्रकाशित: KIT Scientific Publishing 2023
विषय:
ऑनलाइन पहुंच:OAPEN Library: download the publication
OAPEN Library: description of the publication
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विवरण
सारांश:The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.
भौतिक वर्णन:1 electronic resource (220 p.)
आईएसबीएन:KSP/1000156532
अभिगमन:Open Access