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Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry

Thesis (M.Eng.)--Chulalongkorn University, 1995

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Bibliographic Details
Main Author:	Benjang Monkollertsirisuk (Author)
Other Authors:	Ura Pancharoen (Contributor), Somboon Manoonsumrit (Contributor), Chulalongkorn University. Graduate School (Contributor)
Format:	Book
Published:	Chulalongkorn University, 2013-07-08T11:21:03Z.
Subjects:	Thesis
Online Access:	Connect to this object online.
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