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Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry

Thesis (M.Eng.)--Chulalongkorn University, 1995

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Détails bibliographiques
Auteur principal:	Benjang Monkollertsirisuk (Auteur)
Autres auteurs:	Ura Pancharoen (Collaborateur), Somboon Manoonsumrit (Collaborateur), Chulalongkorn University. Graduate School (Collaborateur)
Format:	Livre
Publié:	Chulalongkorn University, 2013-07-08T11:21:03Z.
Sujets:	Thesis
Accès en ligne:	Connect to this object online.
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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