The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there were many lead-free solder available, the Sn-Ag-Cu was considered as the best choice. But the solder has its draw backs in terms of melting temper...
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| Materyal Türü: | Kitap |
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Universiti Teknologi MARA, Perlis,
2012-12.
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| Online Erişim: | Link Metadata |
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