The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan

• Autores principales: Yahya, Iziana (Autor), Abd Hamid, Hamidi (Autor), Mayappan, Ramani (Autor)
• Formato: Libro
• Publicado: Universiti Teknologi MARA, Perlis, 2012-12.
• Materias: Article; PeerReviewed
• Acceso en línea: Link Metadata

Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there were many lead-free solder available, the Sn-Ag-Cu was considered as the best choice. But the solder has its draw backs in terms of melting temper...