The effect of wick structure and filling ratio to the vapour chamber performance in electronic cooling system using an experimental method / Fairosidi Idrus ... [et al.]
The need for higher performance of electronic device becomes very important presently. The heat dissipated from the device at high flux demand better cooling system for heat removal in order to maintain performance and reliabilty of the electronic device.
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| Autores principales: | , , , , , , |
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| Formato: | Libro |
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Universiti Teknologi MARA Pulau Pinang,
2011.
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| Acceso en línea: | Link Metadata |
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| Número de Clasificación: |
A1234.567 |
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| Copia 1 | Disponible |