Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah

• Главные авторы: Mohamed, Mazlan (Автор), Atan, Rahim (Автор), Abdullah, Mohd Zulkifly (Автор)
• Формат: ‌
• Опубликовано: Universiti Teknologi MARA Pulau Pinang, 2011.
• Предметы: Article; NonPeerReviewed
• Online-ссылка: Link Metadata

This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.