PENGARUH TEMPERATUR DAN LAJU REGANGAN TERHADAP SIFAT MEKANIK MATERIAL SOLDER BEBAS TIMBAL Sn-3.0Ag-0.5Cu
The purpose of this study is to investigate the mechanical characteristics of Sn-3.0Ag.0.5Cu (SAC305) lead free solder material under the influence of temperature and strain-rate. Tensile testing was carried out on SAC305 solder wires at temperatures of 20, 60, 90, 120, 150 ºC, for each temperature...
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Main Author: | Ananda Aransa, - (Author) |
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Format: | Book |
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2020-02-06.
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