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Semiconductor Packaging Materials Interaction and Reliability

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Bibliographic Details
Main Author: Chen, Andrea (auth)
Other Authors: Lo, Randy Hsiao-Yu (auth)
Format: Electronic Book Chapter
Language:English
Published: Taylor & Francis 2012
Subjects:
Electronics engineering
Circuits & components
Materials science
Circuits and Devices
Electromagnetics and Microwaves
Electronic Packaging
ENG
MATERIALS
ElectricalEngineering
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
wafer
Online Access:DOAB: download the publication
DOAB: description of the publication
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