Semiconductor Packaging Materials Interaction and Reliability

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Bibliografski detalji
Glavni autor:	Chen, Andrea (auth)
Daljnji autori:	Lo, Randy Hsiao-Yu (auth)
Format:	Elektronički Poglavlje knjige
Jezik:	engleski
Izdano:	Taylor & Francis 2012
Teme:	Electronics engineering Circuits & components Materials science Circuits and Devices Electromagnetics and Microwaves Electronic Packaging ENG MATERIALS ElectricalEngineering SCI-TECH STM array ball compound frame grid lead level molding package wafer
Online pristup:	DOAB: download the publication DOAB: description of the publication
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Semiconductor Packaging Materials Interaction and Reliability od Chen, Andrea

Izdano 2012

OAPEN Library: download the publication
OAPEN Library: description of the publication

Elektronički Poglavlje knjige

Semiconductor Packaging Materials Interaction and Reliability

Semiconductor Packaging Materials Interaction and Reliability od Chen, Andrea

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