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Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...

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Bibliografiske detaljer
Hovedforfatter:	Lindenmann, Nicole (auth)
Format:	Electronisk Book Chapter
Sprog:	engelsk
Udgivet:	KIT Scientific Publishing 2018
Serier:	Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ)
Fag:	Technology: general issues optische Aufbau- und Verbindungstechnik Photonic Wire Bonding optical interconnects photonic integrated circuits integrierte Photonik Silizium-Photonik silicon photonics photonic wire bonding
Online adgang:	DOAB: download the publication DOAB: description of the publication
Tags:	Tilføj Tag Ingen Tags, Vær først til at tagge denne postø!

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