Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems
Objectives. This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (S...
Tallennettuna:
Päätekijät: | , , , , |
---|---|
Aineistotyyppi: | Kirja |
Julkaistu: |
Hindawi Limited,
2019-01-01T00:00:00Z.
|
Aiheet: | |
Linkit: | Connect to this object online. |
Tagit: |
Lisää tagi
Ei tageja, Lisää ensimmäinen tagi!
|
Internet
Connect to this object online.3rd Floor Main Library
Hyllypaikka: |
A1234.567 |
---|---|
Nide 1 | Saatavissa |