Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

• मुख्य लेखकों: Ceci Nunes Carvalho (लेखक), Marcos Daniel Septímio Lanza (लेखक), Letícia Gomes Dourado (लेखक), Edilausson Moreno Carvalho (लेखक), José Bauer (लेखक)
• स्वरूप: पुस्तक
• प्रकाशित: Hindawi Limited, 2019-01-01T00:00:00Z.
• विषय: article
• ऑनलाइन पहुंच: Connect to this object online.

Objectives. This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (S...