Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

• Päätekijät: Ceci Nunes Carvalho (Tekijä), Marcos Daniel Septímio Lanza (Tekijä), Letícia Gomes Dourado (Tekijä), Edilausson Moreno Carvalho (Tekijä), José Bauer (Tekijä)
• Aineistotyyppi: Kirja
• Julkaistu: Hindawi Limited, 2019-01-01T00:00:00Z.
• Aiheet: article
• Linkit: Connect to this object online.

Objectives. This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (S...