Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

• Asıl Yazarlar: Ceci Nunes Carvalho (Yazar), Marcos Daniel Septímio Lanza (Yazar), Letícia Gomes Dourado (Yazar), Edilausson Moreno Carvalho (Yazar), José Bauer (Yazar)
• Materyal Türü: Kitap
• Baskı/Yayın Bilgisi: Hindawi Limited, 2019-01-01T00:00:00Z.
• Konular: article
• Online Erişim: Connect to this object online.

Objectives. This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (S...