Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

• Main Authors: Ceci Nunes Carvalho (Author), Marcos Daniel Septímio Lanza (Author), Letícia Gomes Dourado (Author), Edilausson Moreno Carvalho (Author), José Bauer (Author)
• Formato: Livro
• Publicado em: Hindawi Limited, 2019-01-01T00:00:00Z.
• Assuntos: article
• Acesso em linha: Connect to this object online.

Objectives. This study evaluated the effect of air-drying time and light-curing time on the degree of conversion (DC) of three etch-and-rinse adhesive systems: ONE-STEP (OS) and ONE-STEP plus (OSP), Ambar (AMB), and two multimode adhesive systems: All-Bond Universal (ABU) and ScotchBond Universal (S...