Chapter MEMS Technologies Enabling the Future Wafer Test Systems
As the form factor of microelectronic systems and chips are continuing to shrink, the demand for increased connectivity and functionality shows an unabated rising trend. This is driving the evolution of technologies that requires 3D approaches for the integration of devices and system design. The 3D...
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Formato: | Electrónico Capítulo de libro |
Idioma: | inglés |
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InTechOpen
2018
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Acceso en liña: | OAPEN Library: download the publication OAPEN Library: description of the publication |
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DOAB: description of the publication
Chapter MEMS Technologies Enabling the Future Wafer Test Systems
Publicado 2018
DOAB: download the publication
DOAB: description of the publication
Electrónico
Capítulo de libro